Issue
Korean Journal of Chemical Engineering,
Vol.31, No.7, 1271-1275, 2014
Effects of cobalt and cobalt oxide buffer layers on nucleation and growth of hot filament chemical vapor deposition diamond films on silicon (100)
An initial study on the nucleation and growth of diamond, using hot filament chemical vapor deposition(HFCVD) technique, was carried out on Co and CoO thin buffer layers on non-carbon substrates (Si (100)), and the results were compared with conventional scratching method. The substrate temperature during the growth was maintained at 750±50 ℃. A mixture of CH4 and H2 (1 : 100 volume %) was used for deposition. The total pressure during the two hour deposition was 30±2 Torr. X-ray photoelectron spectroscopy (XPS) study showed the diamond nucleation at different time periods on the Co and CoO seed layers. It is observed that Co helps in nucleation of diamond even though it is known to degrade the quality of diamond film on W-C substrate. The reason for improvement in our study is attributed to (i) the low content of Co (~0.01%) compared to W-C substrate (~5-6%), (ii) formation of CoSi2 phase at elevated temperature, which might work as nucleation sites for diamond. SEM analysis reveals a change in the morphology of diamond film grown on cobalt oxide and a significant reduction in the size of densely packed crystallites. Raman spectroscopic analysis further suggests an improvement in the quality of the film grown on CoO buffer layer.
[References]
  1. Dar MA, Kim YS, Ansari SG, Kim HI, Khang G, Chiem CV, Shin HS, Korean J. Chem. Eng., 22(5), 770, 2005
  2. Toyota H, Nomura S, Takahashi Y, Mukasa S, Dia. Rel. Mater., 17, 1902, 2008
  3. Kamo M, Sato Y, Matsumoto S, Setaka N, J. Cryst. Growth, 62, 642, 1983
  4. Akaisuka F, Hirose Y, Komaki K, Jpn. J. Appl. Phys., 27, 1600, 1988
  5. Whitmell DS, Williamson R, Thin Sol. Films, 35, 255, 1976
  6. Mori T, Namba Y, J. Vac. Sci. Technol. A, 1, 23, 1983
  7. Buerki PR, Leutwyler S, J. Appl. Phys., 69, 3739, 1991
  8. Angus JC, Will HA, Stanko WS, J. Appl. Phys., 39, 2915, 1968
  9. Sung CM, Tai MF, Int. J. Refract. Met. Hard Mater., 15, 237, 1997
  10. Collins AT, Spear PM, J. Phys. D, 15, 183, 1982
  11. Mitsuda K, Kojima Y, Yoshida T, Akashi K, J. Mater. Sci., 22, 1557, 1987
  12. Yugo S, Kanai T, Kimura T, Muto T, Appl. Phy. Lett., 58, 1036, 1991
  13. Stoner BR, Ma GHM, Wolter SD, Glass JT, Phys. Rev. B, 45, 11067, 1992
  14. Ong TP, Xiong F, Chang RPH, White CW, J. Mater. Res., 7, 2429, 1992
  15. Ihra M, Komiyama H, Okubo T, Appl. Phys. Lett., 65, 1192, 1994
  16. Kobayashi K, Mutsukura N, Machi Y, Mater. Manuf. Processes, 7, 395, 1992
  17. Feng Z, Komvopopulos K, Brown IG, Bogy DB, J. Appl. Phys., 74, 2841, 1993
  18. Dar MA, Ansari SG, Ansari ZA, Umemoto H, Kim YS, Seo HK, Kim GS, Suh EK, Shin HS, Int. J. Refract. Met. Hard Mater., 24, 418, 2006
  19. Musale DV, Pai MP, Sainkar SR, Kshirsagar ST, Mater. Lett., 39, 86, 1999
  20. Yoshiwaka M, Kaneko Y, Yang CF, Tokura H, Kamo M, J. Japan. Soc. Precision Eng., 54, 1703, 1988
  21. Gicquel A, Silva F, Hassouni K, J. Electrochem. Soc., 147(6), 2218, 2000
  22. Dar MA, Ansari SG, Seo HK, Kim GS, Kim YS, Kulkarni SK, Shin HS, Carbon, 43, 855, 2005
  23. Katoh M, Aoki H, Kawarda H, Jpn. J. Appl. Phys., 33, 194, 1994
  24. Zhang YF, Zhang F, Gao QJ, Peng XF, Lin ZD, Dia. Rel. Mater., 10, 1523, 2001
  25. Baranauskas V, Ceragioli HJ, Peterlevitz AC, Tosin MC, Durrant SF, Thin Sol. Films, 377, 303, 2000
  26. Lawson SC, Kanda H, Watanabe K, Kiflawi I, Sato Y, Collins AT, J. Appl. Phys., 79, 4348, 1996
  27. Donnet JB, Paulmier D, Oulanti H, Huu TL, Carbon, 42, 2215, 2004
  28. Ansari SG, Anh TL, Seo HK, Sung KG, Mushtaq D, Shin HS, J. Cryst. Growth, 265(3-4), 563, 2004
  29. Dar MA, Ansari SG, Kim YS, Kim GS, Seo HK, Shin J, Kulkarni SK, Shin HS, Thin Solid Films, 497(1-2), 103, 2006
  30. Robertson J, Mater. Sci. Eng. R, 37, 129, 2002