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HWAHAK KONGHAK,
Vol.40, No.3, 310-315, 2002
Vol.40, No.3, 310-315, 2002
반도체칩 봉지재용 에폭시 몰딩 컴파운드의 점도거동
Viscosity Behaviors of Epoxy Molding Compound for the Semiconductor Microchip Encapsulant
반도체 봉지재용 에폭시 몰딩재(EMC)의 점도를 평형판형 레오미터와 특별히 고안된 슬릿형 레오미터를 이용하여 측정하였다. 저온과 저전단율에서의 점도는 평행판 레오미터를 이용하여, 그리고 고온과 고전단율에서의 점도는 슬릿형 레오미터를 이용하였다. 평행판형 레오미터 실험결과는 Cox-Merz식 보다는 변형된 Cox-Merz식이 EMC의 점도거동을 더 잘 나타내고 있음을 보여주었으며, 고온 고전단율에서 슬릿형 레오미터를 이용하여 측정한 점도측정 자료는 이 자료에 의해 결정된 Cross-Macosko식의 점도값과 잘 일치됨을 보였다. 또한, EMC의 spiral flow length는 슬릿형 레오미터와 시차주사열량계(DSC)로 각각 결정된 Cross-Macosko식과 Kamal식을 이용한 예측치와 잘 일치되었다.
The viscosity of epoxy molding compound(EMC) for the encapsulation of semiconductor chip has been measured using a parallel plate rheometer and a specially designed slit rheometer. The viscosity of EMC at low temperature and low shear rate has been determined with a parallel plate rheometer, while that at high temperature and high shear rate has been determined with the slit rheometer. The experimental results of the parallel plate rheometer revealed that the modified Cox-Merz relation was more suitable for the characterization of viscosity behavior of EMC than the Cox-Merz relation. The viscosity data measured using the specially designed slit rheometer at high temperature and shear rate exhibited a good agreement with the fitted values calculated using the Cross-Macosko equation. The Cross-Macosko equation and Kamal equation determined by the slit rheometer and differential scanning calorimeter(DSC), respectively, made a good prediction in spiral flow length of EMC.
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