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Search / Korean Journal of Chemical Engineering
Total 1 articles [ 키워드: Slit Rheometer ]
No. Article
1 HWAHAK KONGHAK, 40 (3), pp.310-315 (2002)
반도체칩 봉지재용 에폭시 몰딩 컴파운드의 점도거동
Viscosity Behaviors of Epoxy Molding Compound for the Semiconductor Microchip Encapsulant
이명천, Han S