Korean Chem. Eng. Res.
Print:
ISSN 0304-128X
Online:
ISSN 2233-9558
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Search / Korean Journal of Chemical Engineering
Total
1
articles [
키워드
:
Kamal
]
No.
Article
1
HWAHAK KONGHAK
,
40
(3), pp.310-315 (2002)
반도체칩 봉지재용 에폭시 몰딩 컴파운드의 점도거동
Viscosity Behaviors of Epoxy Molding Compound for the Semiconductor Microchip Encapsulant
이명천, Han S
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