| Issue |
| Total 82 articles [ 키워드: Copper ] |
| No. | Article |
| 51 |
Korean Journal of Chemical Engineering, 29 (5), pp.668-675 (2012) Selective extraction, separation and recovery of Cu(II) in presence of Zn(II) and Ni(II) from leach liquor of waste printed circuit board using microcapsules coated with Cyanex 272 Hossain MS, Bari MF, Jamaludin SB, et al. |
| 52 |
Korean Journal of Chemical Engineering, 29 (4), pp.529-533 (2012) Prevention of blister formation in electrolessly deposited copper film on organic substrates Seo JW, Nam HS, Lee S, et al. |
| 53 |
Korean Journal of Chemical Engineering, 29 (2), pp.243-248 (2012) Morphology-controlled Synthesis of CuO nano- and microparticles using microwave irradiation Jung A, Cho S, Cho WJ, et al. |
| 54 |
Korean Journal of Chemical Engineering, 28 (7), pp.1523-1531 (2011) Modification and characterization of amberlite XAD-2 with calcein blue for preconcentration and determination of copper(II) from environmental samples by atomic absorption spectroscopy Moniri E, Panahi HA, Karimi M, et al. |
| 55 |
Korean Journal of Chemical Engineering, 28 (5), pp.1200-1206 (2011) Combined effect of co-existing heavy metals and organophosphate pesticide on adsorption of atrazine to river sediments Qian G, Ao W, Yu L |
| 56 |
Korean Journal of Chemical Engineering, 28 (2), pp.440-444 (2011) Synthesis of copper-poly tetrafluoro-ethylene composites by supercritical impregnation process Kim EB, Kim JT, Kim SY, et al. |
| 57 |
Korean Journal of Chemical Engineering, 27 (5), pp.1596-1600 (2010) Characteristics of electrodeposited CoWP capping layers using alkali-metal-free precursors Namkoung YM, Lee HM, Son YS, et al. |
| 58 |
Korean Journal of Chemical Engineering, 27 (4), pp.1239-1245 (2010) Copper biosorption by Myriophyllum spicatum: Effects of temperature and pH Li G, Xue P, Yan C, et al. |
| 59 |
Korean Journal of Chemical Engineering, 27 (2), pp.431-434 (2010) Effect of preparation method on structure and catalytic activity of Cr-promoted Cu catalyst in glycerol hydrogenolysis Kim ND, Oh S, Joo JB, et al. |
| 60 |
Korean Journal of Chemical Engineering, 27 (1), pp.310-314 (2010) Study on electrochemical mechanical polishing process of copper circuit on PCB Kulyk N, An CY, Oh JH, et al. |
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