| Issue |
Korean Journal of Chemical Engineering,
Vol.17, No.1, 41-46, 2000
Vol.17, No.1, 41-46, 2000
Thermal Fatigue-Resistant EMCs (Epoxy Molding Compounds) for Microelectronic Encapsulation
Highly thermal conductive EMCs (Exopy Molding Compounds) should be considered for the alleviation of thermal stress-related problems caused by low thermal conductivity, and high elastic modulus of EMCs and by a mismatch of CTE (Coefficient of Thermal Expansion) between EMCs and the Si-wafer. Compared to crystalline silica-filled EMCs, alumina filed EMC improved the value of thermal conductivity by 100% and lowered the value of CTE by 50%. As a result, compared to typical crystalline silica-filled EMCs, the thermal fatigue resistance of alumina-filled EMC was improved by sixfold.
[References]
- Biernath RW, Soane DS, Contemporary Topic Polym. Sci., 1992
- Incropera FP, Dewitt DP, "Introduction to Heat Transfer," 3(rd) Eds., John Wiley and Sons, New York, 50, 1996
- Kim W, Bae JW, Choi I, Kim Y, Polym. Eng. Sci., 39(4), 756, 1999
- Kim W, Bae JW, Kang H, Lee M, Choi ID, J. Korean Ind. Eng. Chem., 8(3), 533, 1997
- Kingery WO, Bower HK, Uhlmann DR, "Introduction to Ceramics," Comprise, Massachusetts, Chap. 18, 1975
- Lupinski JH, "Polymer Materials for Electronics Packaging and Interconnection," American Chemical Society, Washington DC, 1989
- Manson SS, "Thermal Stress and Low Cycle Fatigue, Bobrowsky Thermal Shock Parameter," Robert E. Krieger Publishing Company, Malabar, Florida, Section 7.1, 383, 1981
- Manzione LT, "Plastic Packaging of Microelectronic Devices," Van Nostrand Reinhold, New York, 1990
- McClean WJ, "Status 1986, A Report of the Integrated Circuit Industry," Integrated Circuit Engineering Corporation, 1986
- Thompson LF, "Polymer for Microelectronics," ACS Symposium Series 537, American Chemical Society, Washington DC, 1994
- Tummala RR, "Microelectronics Packaging Handbook," Van Nostrand Reinhold, New York, 1989
- Verma LS, Shrotriya AK, Ramvir S, Chandhary DR, J. Phys. D: Appl. Phys., 24, 1729, 1991
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