Issue
Korean Journal of Chemical Engineering,
Vol.20, No.2, 239-246, 2003
Oxidation of Volatile Organic Compounds by Using a Microwave-Induced Plasma Process
A microwave plasma system using a 2.45 GHz magnetron was applied to the decomposition of volatile organic compounds such as toluene and trichloroethylene. Designed for producing plasma at atmospheric pressure, this microwave plasma system consists of a magnetron detached from a household microwave oven, a directional coupler, a three-stub tuner, a tapered waveguide, and plasma flame section where a quartz tube with a nozzle is located. In this system, the organic compounds can be decomposed by thermal incineration as well as by reactions with various active species formed during plasma discharge. The effect of feed gas flow rate on the decomposition was significant due to the decrease in the gas temperature, but the initial concentration in the range of 210-2,100 ppm did not largely affect the decomposition efficiency. The principal byproduct was nitrogen oxides because this system was operated at high temperature. To improve the decomposition of the organic compounds, argon was used as a plasma-assisting gas, together with the air-like feed gas mixture. Large enhancement in the decomposition efficiency was achieved by the use of argon.
[References]
  1. Atkinson R, Baulch DL, Cox RA, Hampson RF, Kerr JA, Troe J, J. Phys. Chem. Ref. Data, 21(6), 1125, 1992
  2. Bae YS, Choi EM, Chung WS, Lee YH, Namkung W, Cho MH, "Development of 2.45 GHz Waveguide-Based Air Torch System," Joint Int. Plasma Symp. 6th APCPST, 15th SPSM, OS2002 and 11th KAPRA, Lotte Hotel, Jeju, South Korea, July 1-4, 2002
  3. Baeva M, Gier H, Pott A, Uhlenbusch J, Plasma Chem. Plasma Process., 21, 225, 2001
  4. Bailin LJ, Sibert ME, Jonas LA, Bell AT, Environ. Sci. Technol., 9, 254, 1975
  5. Cho WI, Baek YS, Pang HS, Kim YC, Moon SK, J. Korean Ind. Eng. Chem., 9(1), 94, 1998
  6. Cho W, Baek Y, Pang H, Kim YC, Korean J. Chem. Eng., 15(5), 500, 1998
  7. Cho SJ, Ryoo MW, Soun KS, Lee JH, Kang SK, Korean J. Chem. Eng., 16(4), 478, 1999
  8. Choi YS, Song YH, Kim SJ, Kim BU, HWAHAK KONGHAK, 38(3), 423, 2000
  9. Cooper CD, Alley FC, "Air Pollution Control: A Design Approach," Waveland Press, Inc., 1994
  10. Futamura S, Zhang A, Yamamoto T, IEEE Trans. Ind. Appl., 35(4), 760, 1999
  11. Jeong HK, Kim SC, Han C, Lee H, Song HK, Na BK, Korean J. Chem. Eng., 18(2), 196, 2001
  12. Kim JS, Lee TK, Korean J. Chem. Eng., 18(6), 935, 2001
  13. Kim SJ, Cho SY, Kim TY, Korean J. Chem. Eng., 19(1), 61, 2002
  14. Kohno H, Berezin AA, Chang JS, Tamura M, Yamamoto T, Shibuya A, Honda S, IEEE Trans. Ind. Appl., 34(5), 953, 1998
  15. Krasnoperov LN, Krishtopa LG, Bozzelli JW, J. Adv. Oxid. Technol., 2(1), 248, 1997
  16. Kucukarpaci H, Lucas J, J. Phys. D, 12, 2123, 1979
  17. Mok YS, Kim JH, Nam IS, Ham SW, Ind. Eng. Chem. Res., 39(10), 3938, 2000
  18. Mok YS, Nam CM, Cho MH, Nam I, IEEE Trans. Plasma Sci., 30(1), 408, 2002
  19. Moon S, Chae J, J. Korean Soc. Environ. Eng., 23, 243, 2001
  20. Oda T, Yamashita R, Haga I, Takahashi T, Masuda S, IEEE Trans. Ind. Appl., 32(1), 118, 1996
  21. Ogata A, Shintani N, Mizuno A, Kushiyama S, Yamamoto T, IEEE Trans. Ind. Appl., 35(4), 753, 1999
  22. Park HK, "Microwave Engineering," 3rd Ed., Hee Jung Dang Press, 1991
  23. Rosocha LA, Anderson GK, Bechtold LA, Coogan JJ, Heck HG, Kang M, McCulla WH, Tennant RA, Wantuck PJ, "Treatment of Hazardous Organic Wastes Using Silent Discharge Plasmas," Non-Thermal Plasma Techniques for Pollution Control: Part B, Springer-Verlag, Berlin, Germany, 281, 1993
  24. Sieck LW, Buckley TJ, Herron JT, Green DS, Plasma Chem. Plasma Process., 21(3), 441, 2001
  25. Snyder HR, Anderson GK, IEEE Trans. Plasma Sci., 26(6), 1695, 1998
  26. Song JH, Seo KW, Mok YI, Park KY, Ahn BS, Korean J. Chem. Eng., 19(2), 246, 2002
  27. Song Y, Shin D, Shin W, Kim K, Choi Y, Choi YS, Lee W, Kim S, J. Korean Soc. Atmospheric Environ., 16(3), 247, 2000
  28. Uhm HS, "Contamination Control of Emission Discharge," U.S. Patent, 5,380,328, 1998
  29. vonHagen J, Venot Y, Zhang Y, Wiesbeck W, IEEE Trans. Plasma Sci., 29(4), 604, 2001
  30. Wojtowicz MA, Miknis FP, Grimes RW, Smith WW, Serio MA, J. Hazard. Mater., 74, 81, 2000
  31. Yan K, Hui H, Cui M, Miao J, Wu X, Bao C, Li R, J. Electrostatics, 44, 17, 1998