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Issue
Korean Journal of Chemical Engineering,
Vol.19, No.3, 451-462, 2002
Applications of Atomic Layer Chemical Vapor Deposition for the Processing of Nanolaminate Structures
Yong K, Jeong J
Atomic layer chemical vapor deposition (ALCVD) is a variant of a CVD process that involves surface deposition for the controlled growth of nano-thickness films. ALCVD is based on the self-limiting surface reaction with less than a monolayer chemisorption of chemical precursors. Advantages of the ALCVD process are uniform film growth on large area substrate, easy control of composition in atomic level, low growth temperature, multi-layer thin film growth with various composition, and wide process window. Since initially developed by Suntola in 1977, ALCVD has been used for the growth of various materials, including oxides, nitrides, metals, elements, and compound semiconductors. This article reviews the basic principle, mechanism, characteristics, and applications of ALCVD.
Keywords: Atomic Layer Chemical Vapor Deposition; Self-limiting Chemisorption; Nano-Deposition; Gate Oxide; Capacitor Dielectric Thin Film
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[Cited By]
  1. Kim IW, Kim SJ, Kim DH, Woo H, Park MY, Rhee SW, Korean Journal of Chemical Engineering, 21(6), 1256, 2004
  2. Heo JS, Ryu HK, Cho YS, Kim JC, Moon SH, Korean Journal of Chemical Engineering, 23(1), 153, 2006
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