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Issue
Korean Journal of Chemical Engineering,
Vol.32, No.12, 2375-2383, 2015
Feasibility study of solvent recycle process in spin-on hard mask material manufacturing system
Jeong HJ, Park K, Yang DR
The spin-on hard mask material for photo resist in semiconductor industry is usually obtained from a small-scale batch process. To obtain high purity products requires multiple-step purification processes, during which a large amount of organic solvent waste is emitted. In this study, a process for regenerating high purity solvent was proposed and the economic efficiency of the proposed process was analyzed. Also, a sensitivity analysis was performed to analyze the changing economics regarding the main variables. From the analysis, the break-even point can be achieved within one year for different cases considered. On the basis of 4-year operation, the profit margins for each case were determined and compared. It is concluded that the waste solvent regeneration process for spin-on hard mask material production in semiconductor industry is feasible and recommended.
Keywords: Spin-on Hard Mask Material; Regeneration; Economic Analysis; Sensitivity Analysis
[References]
  1. Wei Y, Brainard RL, Advanced processes for 193-nm immersion lithography, SPIE Bellingham, Washington (2009).
  2. Subramanian R, Wang F, Lukanc TP, Okada LA, U. S. Patent, 6,309,955 (2001).
  3. Takei S, Ogawa T, Deschner R, Jen K, Nihira T, Hanabata M, Willson CG, Jpn. J. Appl. Phys., 49, 075201, 2010
  4. Yun H, Yeom S, Yang DR, Korean J. Chem. Eng., 31(5), 748, 2014
  5. Oh CI, Uh DS, Kim DH, Lee JK, Yun HC, Nam I, Kim MS, Yoon KH, Hyung KH, Tokareva N, Advanced Lithography, 65192R-65192R-10 (2007).
  6. Lee K, Kim S, Lee G, Lee S, Cho J, Kim W, Bok C, Kim H, Moon S, Kim J, SPIE 31st International Symposium on Advanced Lithography, 61532V-61532V-8 (2006).
  7. Kim SK, Cho HM, Woo C, Koh SR, Kim MY, Yoon HC, Lee W, Shin SW, Kim JS, Chang T, SPIE Lithography Asia-Taiwan, 71402V-71402V-7 (2008).
  8. Iglesias M, Gonzalez-Olmos R, Salvatierra D, Resa J, J. Mol. Liq., 130, 52, 2007
  9. Ko MS, Na S, Cho J, Kim H, Korean J. Chem. Eng., 19(6), 996, 2002
  10. Luyben WL, Distillation design and control using aspen simulation, John Wiley & Sons (2013).
  11. O’sullivan A, Sheffrin SM, Perez SJ, Survey of economics, Upper Saddle River, NJ, USA: Pearson Prentice Hall (2010).
  12. Hendry J, Rudd D, Seader J, AIChE J., 19, 1, 1973
  13. Hazeltine B, Bull C, Field guide to appropriate technology, Academic Press (2003).
  14. Zhang Y, Dube MA, McLean DD, Kates M, Bioresour. Technol., 90(3), 229, 2003
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