Issue
Korean Journal of Chemical Engineering,
Vol.32, No.6, 1194-1200, 2015
Microstructure and corrosion behavior of electrodeposited nanocrystalline nickel prepared from acetate bath
The present investigation deals with the electrodeposition of nanocrystalline nickel onto mild steel metallic foil from electrolytes containing nickel acetate as the major metal salt. Two different chlorides, potassium chloride and nickel chloride, were tried for two different baths. Potassium citrate was used as buffer for alternate to boric acid. The additives tried were sodium lauryl sulfate as wetting agent, saccharin as primary brightener and 2-butyne 1,4-diol as secondary brightener. These additives are found to improve the hardness, grain size, surface morphology of the electrodeposited nickel films and throwing power of the nickel acetate electrolytes. The nickel films prepared from nickel chloride containing electrolytes showed higher corrosion resistance as compared to potassium chloride containing electrolytes, because the nickel films produced from the nickel chloride electrolytes are compact and possess fine grained structure. The XRD pattern obtained for electrodeposited nickel shows polycrystalline face centered cubic structure. The crystal size was calculated using Scherrer formula. A uniform and pore free surface was observed under SEM analysis.
[References]
  1. Lowenheim FA, Modern electroplating, New York, McGraw-Hill(1978).
  2. Ebrahimi F, Kong D, Matthews TE, Zhai Q, Processing and Fabrication of Advanced Materials VII Ed., Warrendale, PA, TMS Publication, 509 (1988).
  3. Trasatti S, Electrochim. Acta, 37, 2137, 1992
  4. Franklin TC, Plat. Surf. Finish., 81, 62, 1994
  5. Oniciu L, Muresan L, J. Appl. Electrochem., 21, 565, 1991
  6. Plieth W, Electrochim. Acta, 37, 2115, 1992
  7. Sekar R, Eagammai C, Jayakrishnan S, J. Appl. Electrochem., 40(1), 49, 2010
  8. Merchant HD, Defect structure, morphology and properties of deposits, Warrendale, PA, TMS Publication 1 (1995)., 1995
  9. Dennis JK, Such TE, Nickel and Chromium plating, London, Newnes-Butterworths, 163 (1972)., 1972
  10. Notification of the Director General of the Environment Agency in Japan, 2, 22 (1999)., 1999
  11. Doi T, Mizumoto K, Tanaka S, Yamashita T, Met. Finish, 102, 26, 2004
  12. Sekar R, Jayakrishnan S, Plat. Surf. Finish., 92, 58, 2005
  13. Sekar R, Kala C, Krishnan RM, Trans. Inst. Met. Finish, 80, 173, 2002
  14. Sekar R, Krishnan RM, Muralidharan VS, Trans. Inst. Met. Finish, 82, 164, 2004
  15. Silman H, Isserlis G, Averill AF, Protective and decorative coatings for metals, Teddington England, Finishing Publications Ltd. (1978).
  16. Sekar R, Jayakrishnan S, J. Appl. Electrochem., 36(5), 591, 2006
  17. Conway BE, JO’M Bockris, Plating, 46, 371, 1959
  18. ASTM-G102-89 Standard Practice for calculation of Corrosion Rates and related information from Electrochemical Measurements, 03.02 435 (2001).
  19. Stern M, Geary AL, J. Electrochem. Soc., 104, 56, 1957
  20. Cullity BD, Elements of X-ray diffraction, USA, Addison Wesley(1967)., 1967
  21. Klug HP, Alexander L, X-ray diffraction procedures for polycrystalline and amorphous materials, New York, Wiley (1980).
  22. Gyawali G, Hamal K, Joshi B, Rajbhandari A, Lee SW, Mater. Lett., 126, 228, 2014
  23. Mansfield F, Kendig W, Tasi S, Corrosion, 38, 570, 1982
  24. Survilline S, Cesuniene A, Juskena R, Trans. Inst. Met. Finish, 82, 185, 2004
  25. Survilline S, Jasualaitiene V, Cesuniene A, Trans. Inst. Met. Finish, 83, 130, 2005
  26. Holm M, O’ Keefe TJ, J. Appl. Chem., 83, 1125, 2000
  27. Gai LP, Mitra R, Weertman JR, Pure. Appl. Chem., 74, 1519, 2002
  28. Amblard J, Epelboin I, Froment M, Maurin G, J. Appl. Electrochem., 9, 223, 1979
  29. Mc Cormack AG, Pomeroy MJ, Cunnane VJ, J. Electrochem. Soc., 150, 356, 2003
  30. Ibanez A, Fatas E, Surf. Coat. Technol., 191, 7, 2005
  31. Budevski E, Staikov G, Lorenz WJ, Electrochim. Acta, 45, 2259, 2000