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Total 9 articles [ 키워드: Filler ] |
No. |
Article |
1 |
Korean Journal of Chemical Engineering, 40 (8), pp.1963-1969 (2023) The use of acetylation to improve the performance of hyaluronic acid-based dermal filler So-Jung Gwak, Yu Bin Lee, Eun Joo Lee, et al. |
2 |
Korean Journal of Chemical Engineering, 39 (7), pp.1968-1974 (2022) Enhanced electrical conductivity and electromagnetic shielding efficiency of epoxy resin using graphene nanoplatelets Dong W, Zhao M, Jin FL, et al. |
3 |
Korean Journal of Chemical Engineering, 38 (2), pp.454-460 (2021) Composite solid polymer electrolyte with silica filler for structural supercapacitor applications Hwang M, Jeong JS, Lee JC, et al. |
4 |
Korean Journal of Chemical Engineering, 36 (9), pp.1389-1400 (2019) The role of membrane technology in acid mine water treatment: a review Agboola O |
5 |
Korean Journal of Chemical Engineering, 36 (6), pp.1004-1012 (2019) Effect of filler size on thermal properties of paraffin/silver nanoparticle composites Kim IH, Sim HW, Hong HH, et al. |
6 |
Korean Journal of Chemical Engineering, 35 (9), pp.1889-1910 (2018) Fabrication of composite membranes for pervaporation of tetrahydrofuran-water: Optimization of intrinsic property by response surface methodology and studies on vulcanization mechanism by density functional theory Mahapatra M, Karmakar M, Dutta A, et al. |
7 |
Korean Journal of Chemical Engineering, 34 (1), pp.225-230 (2017) Synthesis of aragonite-precipitated calcium carbonate from oyster shell waste via a carbonation process and its applications Ramakrishna C, Thenepalli T, Han C, et al. |
8 |
Korean Journal of Chemical Engineering, 32 (6), pp.1009-1022 (2015) A strategy of precipitated calcium carbonate (CaCO3) fillers for enhancing the mechanical properties of polypropylene polymers Thenepalli T, Ahn YJ, Han C, et al. |
9 |
Korean Journal of Chemical Engineering, 24 (6), pp.1037-1041 (2007) Electrochemical properties of gel polymer electrolyte based on poly(acrylonitrile)-poly(ethylene glycol diacrylate) blend Cho BW, Kim DH, Lee HW, et al. |
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