| Issue |
| Total 2 articles [ 키워드: Copper Interconnection ] |
| No. | Article |
| 1 |
Korean Journal of Chemical Engineering, 39 (11), pp.3121-3128 (2022) Dissolution of copper and copper oxide in aqueous solution containing Ko CK, Lee WG |
| 2 |
Korean Journal of Chemical Engineering, 27 (5), pp.1596-1600 (2010) Characteristics of electrodeposited CoWP capping layers using alkali-metal-free precursors Namkoung YM, Lee HM, Son YS, et al. |
