Korean Journal of Chemical Engineering, Vol.34, No.5, 1483-1489, 2017
Effect of electrolyte composition on the morphological structures of dendritic copper powders prepared by a spontaneous galvanic displacement reaction
Dendritic copper powders are highly desirable in many applications, including electromagnetic interference shielding and conductive pastes, because of low cost and high conductivity. We prepared dendritic copper powders using the galvanic displacement reaction between the Al and Cu-ions in aqueous solution. This method is very simple and spontaneous at room temperature. During the process, the morphology of the copper powders is strongly affected by several variables, such as the displacement reaction rate and the amount of hydrogen evolution due to the reduction of proton. The effect of the different composition of electrolytes to morphological changes of copper powders was investigated in this study. In addition, the effects of concentration of chlorine ion, pH, termination time, and additives were monitored, which resulted in different morphology. Considering different applications, such as sensors, catalysts, and conductive pastes, the controllability of the morphology of dendritic copper powders plays an important role in achieving high performance in desired applications.
[References]
Kim CK, Lee GJ, Lee MK, Rhee CK, Powder Technol. , 263 , 1, 2014
Cao XG, Zhang HY, Electron. Mater. Lett. , 8 (4), 467, 2012
Zhang R, Lin W, Lawrence K, Wong CP, Int. J. Adhes. Adhes. , 30 , 403, 2010
Hai HT, Takamura H, Koike J, J. Alloy. Compd. , 564 , 71, 2013
Wu M, Lin B, Cao Y, Song J, Sun Y, Yang H, Zhang X, J. Mater. Sci.-Mater. El. , 24 , 4913, 2013
Khatri I, Hoshino A, Watanabe F, Liu QM, Ishikawa R, Ueno K, Shirai H, Thin Solid Films , 558 , 306, 2014
Theuring M, Vehse M, von Maydell K, Agert C, Thin Solid Films , 558 , 294, 2014
Nishikawa H, Mikami S, Miyake K, Aoki A, Takemoto T, Mater. Trans. , 51 (10), 1785, 2010
Chen Z, Zhang XD, Fang J, Liang JH, Liang XJ, Sun J, Zhang DK, Wang N, Zhao HX, Chen XL, Huang Q, Wei CC, Zhao Y, Appl. Energy , 135 , 158, 2014
Yang TL, Huang KY, Yang S, Hsieh HH, Kao CR, Sol. Energy Mater. Sol. Cells , 123 , 139, 2014
Tsai JT, Lin ST, J. Alloy. Compd. , 548 , 105, 2013
Wen X, Xie YT, Wing M, Mak C, Cheung KY, Li XY, Renneberg R, Yang S, Langmuir , 22 (10), 4836, 2006
Fang J, You H, Kong P, Yi Y, Song X, Ding B, Cryst. Growth Des. , 7 (5), 864, 2007
Lv S, Suo H, Zhao X, Wang C, Jing S, Zhou T, Xu Y, Zhao C, Solid State Commun. , 149 , 1755, 2009
Lu S, Suo H, Wang H, Wang C, Wang J, Xu Y, Zhao C, Solid State Sci. , 12 , 1287, 2010
Lu S, Suo H, Zhou T, Wang C, Jing S, Fu Q, Xu Y, Zhao C, Solid State Commun. , 149 , 227, 2009
Kramer JR, Werstiuk NH, Ni B, J. Phys. Chem. A , 110 (1), 273, 2006
Zhuo YJ, Sun WD, Dong LH, Chu Y, Appl. Surf. Sci. , 257 (24), 10395, 2011
Liu R, Sen A, Chem. Mater. , 24 , 48, 2012
Chen X, Cui CH, Guo Z, Liu JH, Huang XHM, Yu SH, Small , 7 (7), 858, 2011
Liu R, Li S, Yu X, Zhang G, Ma Y, Yao J, Keita B, Nadjo L, Cryst. Growth Des. , 11 , 3424, 2011
Huang TK, Cheng TH, Yen MY, Hsiao WH, Wang LS, Chen FR, Kai JJ, Lee CY, Chiu HT, Langmuir , 23 (10), 5722, 2007
Nadagouda MN, Varma RS, Crys. Growth Des. , 7 (12), 2582, 2007
Jung DS, Lee HM, Kang YC, Park SB, J. Colloid Interface Sci. , 364 (2), 574, 2011
Hai HT, Ahn JG, Kim DJ, Lee JR, Chung HS, Kim CO, Surf. Coat. Technol. , 201 , 3788, 2006
Xu X, Luo X, Zhuang H, Li W, Zhang B, Mater. Lett. , 57 , 3987, 2003
Barcaro G, Fortunelli A, Rossi G, Nita F, Ferrando R, J. Phys. Chem. B , 110 (46), 23197, 2006
Zhao J, Zhang D, Zhao J, J. Solid State Chem. , 184 , 2339, 2011
Cao XG, Zhang HY, Appl. Surf. Sci. , 264 , 756, 2013
Cao XG, Zhang HY, Appl. Surf. Sci. , 264 , 756, 2013
Hai HT, Takamura H, Koike J, J. Alloy. Compd. , 564 , 71, 2013
Wu M, Lin B, Cao Y, Song J, Sun Y, Yang H, Zhang X, J.Mater. Sci.-Mater. Electron. , 24 , 4913, 2013
Kang Y, Chen F, J. Appl. Electrochem. , 46 , 667, 2013
Chen KT, Ray DT, Peng YH, Hsu YC, Curr. Appl. Phys. , 13 (7), 1496, 2013
Cao XG, Zhang HY, Powder Technol. , 226 , 53, 2012
Zhao J, Zhang DM, Song XJ, Appl. Surf. Sci. , 258 (19), 7430, 2012
Mancier V, Bertrand CR, Dille J, Michel J, Fricoteaux P, Ultrason. Sonochem. , 17 , 690, 2010
Tsai CH, Chen SY, Song JM, Chen IG, Lee HY, Corrosion Sci. , 74 , 123, 2013
Cherevko S, Chung CH, Talanta , 80 , 1371, 2010
Arai S, Kitamura T, ECS Electrochem. Lett. , 3 (5), D7, 2014
Qiu R, Cha HG, Noh HB, Shim YB, Zhang XL, Qiao R, Zhang D, Kim YI, Pal U, Kang YS, J. Phys. Chem. C , 113 , 15891, 2009
Djokic SS, Djokic NS, J. Electrochem. Soc. , 158 (4), D204, 2011
Wu SH, Chen DH, J. Colloid Interface Sci. , 273 (1), 165, 2004
Yan C, Xue D, Cryst. Growth Des. , 8 (6), 1849, 2008
Liu Y, Chu Y, Zhuo YJ, Dong LH, Li LL, Li MY, Adv. Funct. Mater. , 17 (6), 933, 2007
Zhang X, Wang G, Liu X, Wu H, Fang B, Cryst. Growth Des. , 4 , 1430, 2008
Zhang ZY, Hu CG, Feng B, Zheng CH, He XS, Wang X, J. Supercond. Nov. Magn. , 23 , 893, 2010
Mahima S, Karthik C, Garg S, Mehta R, Teki R, Ravishankar N, Ramanath G, Cryst. Growth Des. , 10 , 3925, 2010
Zeng Y, Li T, Fu M, Jiang S, Zhang G, J. Alloy. Compd. , 585 , 277, 2014
Huang LM, Luo LM, Ding XY, Luo GN, Zan X, Cheng JG, Wu YC, Powder Technol. , 258 , 216, 2014
Shin HC, Dong J, Liu ML, Adv. Mater. , 15 (19), 1610, 2003
Zhuo K, Jeong MG, Chung CH, RSC Adv. , 3 , 12611, 2013
Soni PL, Vandna Soni, Coordination Chemistry, Taylor & Francis Group, Boca Raton, FL (2013).
Schlesinger M, Paunovic M, Modern electroplating, New York, Wiley, 5th Ed. (2010).
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