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Korean Journal of Chemical Engineering, Vol.30, No.7, 1480-1484, 2013
Hydrophobic properties of films grown by torch-type atmospheric pressure plasma in Ar ambient containing C6 hydrocarbon precursor
The direct deposition of polymeric films with a torch-type atmospheric pressure plasma using benzene, n-hexane and cyclohexane in Ar was performed on several substrates. The surface morphologies of the films deposited with n-hexane and cyclohexane were uniformly smooth for all deposition thicknesses, and the typical water contact angle on the films indicating the degree of hydrophobicity was about 85°. However, the films deposited using benzene had a micro-coarse surface morphology and showed a superhydrophobic property with a water contact angle exceeding 150°. Some trace of oxygen incorporation was shown in all films due to the plasma deposition process in an air ambient. The small amount of oxygenated species did not lead to a decrease of hydrophobicity of the films.
[References]
- Shibuichi S, Onda T, Satoh N, Tsujii K, J. Phys. Chem., 100(50), 19512, 1996
- Oner D, McCarthy TJ, Langmuir, 16(20), 7777, 2000
- Yoshimitsu Z, Nakajima A, Watanabe T, Hashimoto K, Langmuir, 18(15), 5818, 2002
- Foest R, Adler F, Sigeneger F, Schmidt M, Surf. Coat. Technol., 163/164, 323, 2003
- Kakiuchi H, Nakahama Y, Ohmi H, Yasutake K, Yoshii K, Mori Y, Thin Solid Films, 479(1-2), 17, 2005
- Ishizaki T, Saito N, Inoue Y, Bekke M, Takai O, J. Phys. D:Appl. Phys., 40, 192, 2007
- Teshima K, Sugimura H, Inoue Y, Takai O, Takano A, Appl. Surf. Sci., 244(1-4), 619, 2005
- Myung SW, Choi HS, Korean J. Chem. Eng., 23(3), 505, 2006
- Kim JH, Liu GM, Kim SH, J. Mater. Chem., 16, 977, 2006
- Mikikian M, Couedel L, Cavarroc M, Tessier Y, Boufendi L, Eur. Phys. J. Appl. Phys., 49, 13106, 2010
- Takahashi K, Tachibana K, J. Vac. Sci. Technol. A, 19(5), 2055, 2001
- Perrin J, Schmitt J, Hollenstein C, Howling A, Sansonnents L, Plasma. Phys. Controlled Fusion., 42, B353, 2000
- Foglein KA, Babievskaya I, Szabo PT, Szepvolygi J, Plasma Chem. Plasma Process., 23(2), 233, 2003
- Moulder JF, Stickle WF, Sobol PE, Bomben KD, Handbook of X-ray photoelectron spectroscopy, Physical Electronics Inc., Minnesota, 1995
- Kim SH, Kim JH, Kang BK, Langmuir, 23(15), 8074, 2007
- Lee SH, Dilworth ZR, Hsiao E, Barnette AL, Marino M, Kim JH, Kang JG, Jung TH, Kim SH, ACS Appl. Mater. Interfaces., 3, 476, 2011
- Won DS, Kim TK, Lee WG, Surf. Interface Anal., 42, 1209, 2010
[Cited By]
- Park JN, Shin YS, Lee WG, Applied Chemistry for Engineering, 25(6), 598, 2014
- Park JN, Shin YS, Lee WG, Applied Chemistry for Engineering, 26(1), 35, 2015
- Kim BR, Kim DH, Kim YD, Korean Journal of Chemical Engineering, 33(5), 1743, 2016
- Lee SG, Moon JC, Lee WG, Applied Chemistry for Engineering, 33(4), 367, 2022
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