Articles & Issues
- Language
- English
- Conflict of Interest
- In relation to this article, we declare that there is no conflict of interest.
- Publication history
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Received March 15, 2026
Accepted May 28, 2026
Available online October 25, 2026
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This is an Open-Access article distributed under the terms of the Creative Commons Attribution Non-Commercial License (http://creativecommons.org/licenses/bync/3.0) which permits
unrestricted non-commercial use, distribution, and reproduction in any medium, provided the original work is properly cited.
All issues
Process Performance Evaluation of Modified Semiconductor Scrubber System via Process Simulation
https://doi.org/10.1007/s11814-026-00764-6
Abstract
In semiconductor manufacturing, nitrous oxide (N₂O) is a major greenhouse gas emitted during processes such as SiO₂
deposition, requiring effective abatement technologies. Conventional semiconductor scrubber systems rely on catalytic
thermal decomposition and wet scrubbing but suffer from high energy demand and excessive water consumption. To
address these limitations, we designed a modified system integrating a waste heat recovery unit (WHRU) and compared
its system performance with a conventional configuration using commercial process simulation. Validation against literature
data and experimental measurements confirmed the accuracy of the model. Parametric analysis demonstrated that the
modified system reduced power consumption by 55% and achieved a two-fold increase in system efficiency compared
with the conventional system, with the optimal performance observed at a reaction temperature of 1,008 K. These results
highlight the potential of WHRU-integrated scrubbers to enhance energy efficiency and sustainability in semiconductor
exhaust gas treatment.
