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In relation to this article, we declare that there is no conflict of interest.
Publication history
Received February 5, 2025
Accepted February 24, 2025
Available online May 25, 2025
articles This is an Open-Access article distributed under the terms of the Creative Commons Attribution Non-Commercial License (http://creativecommons.org/licenses/bync/3.0) which permits unrestricted non-commercial use, distribution, and reproduction in any medium, provided the original work is properly cited.
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Microfabricated Conductive PEDOT:PSS Hydrogels for Soft Electronics

Materials Research Laboratory , University of Illinois, Urbana-Champaign , Urbana , IL   61801 , USA 1Department of Electrical and Computer Engineering, Department of Materials Science and Engineering, Department of Mechanical Science and Engineering, Department of Bioengineering, Nick Holonyak Micro and Nanotechnology Laboratory , Beckman Institute for Advanced Science and Technology, University of Illinois, Urbana-Champaign , Urbana , IL   61801 , USA
cunjiang@illinois.edu
Korean Journal of Chemical Engineering, May 2025, 42(5), 935-952(18)
https://doi.org/10.1007/s11814-025-00434-z

Abstract

 Soft electronics integrate biology, materials science, and electronic engineering to create devices that could seamlessly 

interface with biological systems. Among soft electronic materials, poly(3,4-ethylenedioxythiophene):polystyrene sulfonate 

(PEDOT:PSS) hydrogels are distinguished by their combined ionic–electronic conductivity, tissue-like mechanics, and 

biocompatibility. Despite these advantages, PEDOT:PSS hydrogels still face challenges, including high water content, 

mechanical weakness, and limited adhesion to conventional electronic materials. These challenges are further intensifi ed 

by the incompatibility of PEDOT:PSS with high-temperature processing and chemically demanding fabrication techniques. 

Consequently, research has increasingly focused on developing PEDOT:PSS hydrogels with advanced fabrication methods 

that enable scalable production, complex structure, and high resolution to meet the requirements of soft electronics. This 

review explores the integration of PEDOT:PSS hydrogels with soft electronics from hydrogel-to-device and device-tohydrogel

perspectives. It explores strategies to enhance the performance of PEDOT:PSS hydrogels and address fabrication 

challenges. Both top-down (e.g., scalable fabrication and high precision) and bottom-up (e.g., tunable conductivity and 

multifunctionality) approaches are examined, emphasizing advances that improve hydrogel integration with manufacturing 

technologies. By analyzing these design principles, this review contributes to hydrogel-based microfabrication and soft 

electronics, driving developments in bioelectronics, soft sensors, and soft robotics. 

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