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Received June 19, 2015
Accepted December 19, 2015
articles This is an Open-Access article distributed under the terms of the Creative Commons Attribution Non-Commercial License (http://creativecommons.org/licenses/bync/3.0) which permits unrestricted non-commercial use, distribution, and reproduction in any medium, provided the original work is properly cited.
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Phenol decomposition in water cathode of DC atmospheric pressure discharge in air

Department of Industrial Ecology, Ivanovo State University of Chemical Technology, Ivanovo 153000, F. Engels 7, Russia, Russian Federation 1Department of Electronic Devices and Materials, Ivanovo State University of Chemical Technology, Ivanovo 153000, F. Engels 7, Russia, Russian Federation 2Department of Chemical Engineering, Chungnam National University, 220 Gung-dong, Yuseong-gu, Daejeon 34134, Korea
Korean Journal of Chemical Engineering, May 2016, 33(5), 1620-1628(9), 10.1007/s11814-015-0292-7
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Abstract

We studied phenol decomposition in aqueous solution under the action of DC discharge at atmospheric pressure in air. The decomposition efficiency was 0.017 molecules per 100 eV. When the kinetics of forming destruction products was studied in detail, the peculiarities of air plasma action were revealed for the first time. Plasma action not only results in the formation of oxygen-containing products, which are usually formed under oxygen plasma action (hydroxyhenols, carboxylic acids, aldehydes), but also the formation of nitro phenols. The treatment is accompanied by hydrogen peroxide formation, a pH decrease, and nitric and nitrous acids formation. We also discussed the possible mechanism of the processes and the role of some active species in chemical transformations after determining some parameters of the discharge.

References

Grabowski LR, van Veldhuizen EM, Pemen AJM, Rutgers WR, Plasma Chem. Plasma Process., 26(1), 3 (2006)
Gao J, Liu Y, Yang W, Pu L, Yu J, Lu Q, Plasma Sources Sci. Technol., 12, 533 (2003)
Tomizawa S, Tezuka M, Plasma Chem. Plasma Process., 27(4), 486 (2007)
Lukes P, Locke BR, J. Phys. D-Appl. Phys., 38, 4074 (2005)
Grymonpre DR, Sharma AK, Finney WC, Locke BR, Chem. Eng. J., 82(1-3), 189 (2001)
Bobkova ES, Grinevich VI, Ivantsova NA, Rybkin VV, Plasma Chem. Plasma Process., 32(1), 97 (2012)
Qu GZ, Lu N, Li J, Wu Y, Li GF, Li D, J. Hazard. Mater., 172(1), 472 (2009)
Njoyim E, Ghogomu P, Laminsi S, Nzali S, Doubla A, Brisset JL, Ind. Eng. Chem. Res., 48(22), 9773 (2009)
Piskarev IM, Technical Physics, 44, 53 (1999)
Janca J, Kuzmin S, Maximov A, Titova J, Czernichowski A, Plasma Chem. Plasma Process., 19(1), 53 (1999)
Jiang B, Zheng JT, Qiu S, Wu MB, Zhang QH, Yan ZF, Xue QZ, Chem. Eng. J., 236, 348 (2014)
Tatarova E, Bundaleska N, Sarette JP, Ferreira CM, Plasma Sources Sci. Technol., 23, 063002 (2014)
Bobkova ES, Ivanova ES, Nevedomyi RA, Sungurova AV, High Energy Chemistry, 48, 346 (2014)
Bobkova ES, Krasnov DS, Sungurova AV, Shishkina AI, Shikova TG, High Energy Chemistry, 47, 53 (2013)
Yan JH, Du CM, Li XD, Cheron BG, Ni MJ, Cen KF, Plasma Chem. Plasma Process., 26(1), 31 (2006)
Eisenberg G, Ind. Eng. Chem. Anal. Ed., 15, 327 (1943)
Verreycken T, Schram DC, Leys C, Bruggeman P, Plasma Sources Sci. Technol., 19, 045004 (2010)
Herzberg G, Molecular Spectra and Molecular Structure: Spectra of Diatomic Molecules, van Nostrand Co., Princeton (1950).
Titov VA, Rybkin VV, Smirnov SA, Kulentsan AL, Choi HS, Plasma Chem. Plasma Process., 26(6), 543 (2006)
Brisset JL, Moussa D, Doubla A, Hnatiuc E, Hnatiuc B, Youbi GK, Herry JM, Naitali M, Bellon-Fontaine MN, Ind. Eng. Chem. Res., 47(16), 5761 (2008)
Ognier S, Iya-sou D, Fourmond C, Cavadias S, Plasma Chem. Plasma Process., 29(4), 261 (2009)
Malik MA, Plasma Sources Sci. Technol., 12, 26 (2003)
Sunka PS, Babicky V, Clupek M, Lukes P, Simek MS, Schmidt J, Cernak MC, Plasma Sources Sci. Technol., 8, 258 (1999)
de Luis A, Lombrana JI, Varona F, Menendez A, Korean J. Chem. Eng., 26(1), 48 (2009)
Bobkova ES, Shikova TG, Rybkin VV, High Energy Chemistry, 46, 141 (2012)
Locke BR, Shih KY, Plasma Sources Sci. Technol., 20, 034006 (2011)
Kuz’micheva LA, Titova YV, Maksimov AI, Surf. Eng. Appl. Electrochem., 44, 281 (2008)
Matsui Y, Takeushi N, Sasaki K, Hayashi R, Yasuoka K, Plasma Sources Sci. Technol., 20, 034015 (2011)
Li L, Nikiforov A, Xiong Q, Lu X, Taghizadeh L, Leys C, J. Phys. D-Appl. Phys., 45, 125201 (2012)
Klotz B, Barnes I, Becker KH, Golding BT, J. Chem. Soc.-Faraday Trans., 93, 1507 (1997)
Teton S, Mellouki A, LeBras G, Sidebottom H, Int. J. Chem. Kinet., 28, 291 (1996)
Bobkova ES, Smirnov SA, Zalipaeva YV, Rybkin VV, Plasma Chem. Plasma Process., 34(4), 721 (2014)
Bobkova ES, Shikova TG, Grinevich VI, Rybkin VV, High Energy Chemistry, 46, 56 (2012)
Staehelin J, Hoignt J, Environ. Sci. Technol., 16, 676 (1982)
Taube H, Bray WC, J. Am. Chem. Soc., 62, 3357 (1940)
Buhler RE, Staehelin J, Hoigne J, J. Phys. Chem., 88, 2560 (1984)
Brisset JL, Hnatiuc E, Plasma Chem. Plasma Process., 32(4), 655 (2012)
Semadeni M, Stocker DW, Kerr JA, Int. J. Chem. Kinet., 27, 287 (1995)
Linstrom PJ, Mallard WG, NIST Chemistry WebBook; NIST Standard Reference Database Number 69; National Institute of Standards and Technology: Gaithersburg MD, 2015; http:// webbook.nist.gov, 20899.
Du CM, Sun YW, Zhuang XF, Plasma Chem. Plasma Process., 28(4), 523 (2008)
Bubnov AG, Burova EY, Grinevich VI, Rybkin VV, Kim JK, Choi HS, Plasma Chem. Plasma Process., 27(2), 177 (2007)
Bobkova ES, Isakina AA, Grinevich VI, Rybkin VV, Russ. J. Appl. Chem., 85, 75 (2012)
Grinevich VI, Plastinina NA, Rybkin VV, Bubnov AG, High Energy Chemistry, 43, 138 (2009)
Bobkova ES, Grinevich VI, Kvitkova EY, Rybkin VV, Izv. Vyssh. Uchebn. Zaved., Khim. Khim. Tekhnol., 54, 55 (2011)

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