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Received February 18, 2013
Accepted May 4, 2013
articles This is an Open-Access article distributed under the terms of the Creative Commons Attribution Non-Commercial License (http://creativecommons.org/licenses/bync/3.0) which permits unrestricted non-commercial use, distribution, and reproduction in any medium, provided the original work is properly cited.
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Hydrophobic properties of films grown by torch-type atmospheric pressure plasma in Ar ambient containing C6 hydrocarbon precursor

Department of Chemical Engineering, Kangwon National University, Chuncheon-si, Gangwon-do 200-701, Korea
wglee@kangwon.ac.kr
Korean Journal of Chemical Engineering, July 2013, 30(7), 1480-1484(5)
https://doi.org/10.1007/s11814-013-0075-y
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Abstract

The direct deposition of polymeric films with a torch-type atmospheric pressure plasma using benzene, n-hexane and cyclohexane in Ar was performed on several substrates. The surface morphologies of the films deposited with n-hexane and cyclohexane were uniformly smooth for all deposition thicknesses, and the typical water contact angle on the films indicating the degree of hydrophobicity was about 85°. However, the films deposited using benzene had a micro-coarse surface morphology and showed a superhydrophobic property with a water contact angle exceeding 150°. Some trace of oxygen incorporation was shown in all films due to the plasma deposition process in an air ambient. The small amount of oxygenated species did not lead to a decrease of hydrophobicity of the films.

References

Shibuichi S, Onda T, Satoh N, Tsujii K, J. Phys. Chem., 100(50), 19512 (1996)
Oner D, McCarthy TJ, Langmuir, 16(20), 7777 (2000)
Yoshimitsu Z, Nakajima A, Watanabe T, Hashimoto K, Langmuir, 18(15), 5818 (2002)
Foest R, Adler F, Sigeneger F, Schmidt M, Surf. Coat. Technol., 163/164, 323 (2003)
Kakiuchi H, Nakahama Y, Ohmi H, Yasutake K, Yoshii K, Mori Y, Thin Solid Films, 479(1-2), 17 (2005)
Ishizaki T, Saito N, Inoue Y, Bekke M, Takai O, J. Phys. D:Appl. Phys., 40, 192 (2007)
Teshima K, Sugimura H, Inoue Y, Takai O, Takano A, Appl. Surf. Sci., 244(1-4), 619 (2005)
Myung SW, Choi HS, Korean J. Chem. Eng., 23(3), 505 (2006)
Kim JH, Liu GM, Kim SH, J. Mater. Chem., 16, 977 (2006)
Mikikian M, Couedel L, Cavarroc M, Tessier Y, Boufendi L, Eur. Phys. J. Appl. Phys., 49, 13106 (2010)
Takahashi K, Tachibana K, J. Vac. Sci. Technol. A, 19(5), 2055 (2001)
Perrin J, Schmitt J, Hollenstein C, Howling A, Sansonnents L, Plasma. Phys. Controlled Fusion., 42, B353 (2000)
Foglein KA, Babievskaya I, Szabo PT, Szepvolygi J, Plasma Chem. Plasma Process., 23(2), 233 (2003)
Moulder JF, Stickle WF, Sobol PE, Bomben KD, Handbook of X-ray photoelectron spectroscopy, Physical Electronics Inc., Minnesota (1995)
Kim SH, Kim JH, Kang BK, Langmuir, 23(15), 8074 (2007)
Lee SH, Dilworth ZR, Hsiao E, Barnette AL, Marino M, Kim JH, Kang JG, Jung TH, Kim SH, ACS Appl. Mater. Interfaces., 3, 476 (2011)
Won DS, Kim TK, Lee WG, Surf. Interface Anal., 42, 1209 (2010)

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