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Korean Chemical Engineering Research,
Vol.56, No.6, 895-900, 2018
Vol.56, No.6, 895-900, 2018
B와 W의 함량이 무전해 Co 합금 박막의 경도에 미치는 영향 연구
Effect of B and W Contents on Hardness of Electroless Co Alloy Thin Films
본 연구에서는 Co-B, Co-W-B 합금 박막 형성을 위한 무전해 전착법을 고안하고, 이를 통해 형성한 합금 박막의 B과 W의 함량이 박막의 경도에 미치는 영향을 살펴보았다. 무전해 전착을 통해 무정형 상태의 Co 합금 박막을 성공적으로 형성할 수 있었으며, 환원제인 dimethylamine borane과 W의 원료인 sodium tungstate dihydrate의 농도를 조절함으로써 Co 합금 박막 내 혼합되는 B과 W의 함량을 조절하였다. 이를 통해 Co 합금 박막 내 전위(dislocation)의 전파(propagation)를 억제하는 B과 W의 함량이 증가할수록 박막의 경도가 증가함을 확인할 수 있었다. 뿐만 아니라, 무전해 전착 시 포기(aeration)를 수행하지 않을 경우에 포기를 수행한 경우보다 Co 합금 박막 내 B과 W의 함량을 대폭 증가시킬 수 있었고 최종적으로 Co-W-B 합금 박막의 경도를 8.9 (±0.3) GPa까지 향상시켰다.
In this study, the electroless deposition of Co-B and Co-W-B alloy thin films was developed and the effect of B and W contents on the hardness of the alloy thin films were investigated. An amorphous Co alloy film was successfully formed by electroless deposition and the contents of B and W in the film were controlled by varying the concentrations of dimethylamine borane and sodium tungstate dihydrate, which were used as a reducing agent and W source, respectively. The hardness of the thin films increased as the contents of B and W were increased because B and W act as impurities suppressing the propagation of dislocation in a film. In addition, it was found that the content of B and W in the Co alloy films can be increased significantly when aeration is not performed. Finally, the hardness of Co- W-B alloy thin film was improved up to 8.9 (±0.3) GPa.
[References]
- Martinez-Hernandez A, Meas Y, Perez-Bueno JJ, Ortiz-Frade LA, Flores-Segura JC, Mendez-Albores A, Trejo G, Int. J. Electrochem. Sci., 12, 1863, 2017
- Pillai AM, Rajendra A, Sharma AK, J. Coat. Technol. Res., 9(6), 785, 2012
- Jappes WJT, Ramamoorthy, B, Nair KP, J. Mater. Process. Technol., 169, 308, 2005
- Krishnaveni K, Narayanan STSN, Seshadri SK, Surf. Coat. Technol., 190, 115, 2005
- Bangwei Z, Wangyu H, Qinglong Z, Xuanyuan Q, Mater. Charact., 37, 119, 1996
- Jin ZY, Li PP, Zheng BZ, Xiao D, Mater. Corros., 64(4), 341, 2013
- Park HJ, Oh EK, Kim SG, Yeu T, Korean Chem. Eng. Res., 32(3), 358, 1994
- Nakano H, Itabashi T, Akahoshi H, J. Electrochem. Soc., 152(3), C163, 2005
- Lim T, Koo HC, Kim KH, Park KJ, Kim MJ, Kwon OJ, Kim JJ, Electrochem. Solid-State Lett., 14(9), D95, 2011
- Goel V, Anderson P, Hall J, Robinson F, Bohm S, J. Magn. Magn. Mater., 407, 42, 2016
- Younan MM, Aly IHM, Nageeb MT, J. Appl. Elechem., 32, 439, 2002
- Wang SL, Thin Solid Films, 515, 8419, 2007
- Samsonov GV, Handbook of the physicochemical properties of the elements, 2nd ed., Plenum Publishing Corporation, New York, NY(1968).
- Einati H, Bogush V, Sverdlov Y, Rosenberg Y, Shacham-Diamand Y, Microelectron. Eng., 82, 623, 2005
- Ofek Almog R, Sverdlov Y, Goldfarb I, Shacham-Diamand Y, Microelectron. Eng., 84, 2450, 2007
- Kim TH, Yun HJ, Kim CK, Korean Chem. Eng. Res., 45(6), 633, 2007
- Homma T, Tamaki A, Nakai H, Osaka T, J. Electroanal. Chem., 559, 131, 2003
- Saito T, Sato E, Matsuoka M, Iwakura C, J. Appl. Elechem., 28, 559, 1998
- Hu B, Sun R, Yu G, Liu L, Xie Z, He X, Zhang X, Surf. Coat. Technol., 228, 84, 2013
- Meyers MA, Mishra A, Benson DJ, Prog. Mater. Sci., 51(4), 427, 2006
- Vaz F, Ferreira J, Ribeiro E, Rebouta L, et al., Surf. Coat. Technol., 191, 317, 2005
- Jiang WG, Su JJ, Feng XQ, Eng. Fract. Mech., 75, 4965, 2008
- Walter C, Antretter T, Daniel R, Mitterer C, Surf. Coat. Technol., 202, 1103, 2007
- Sverdlov Y, Bogush V, Einati H, Shacham-Diamand Y, J. Electrochem. Soc., 152(9), C631, 2005
- Hanna F, Hamid A, Aal AA, Mater. Lett., 58, 104, 2003
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