When NCAs(non-conductive adhesives) are used for adhesion of micro-electronic devices, they often show problems such as delamination and cracking, due to the differences of CTE(coefficients of thermal expansion) between NCAs and substrates. Additions of inorganic particles or flexibilizers have been performed to solve those problems. The effects of silica addition on thermal/mechanical properties of amino modified siloxane(AMS)/silica/epoxy-nanocomposites were examined. The silica was treated by 3-glycidoxypropyltrimethoxysilane(GPTMS) for better compatibility between silica and epoxy matrix. AMS/silica/epoxy-nanocomposites filled with various amounts of AMS(1 and 3 phr) and various amounts of silica(3, 5 and 7 phr) were prepared. And Tg, moduli and CTE of nanocomposites were analyzed. Tg of AMS/Aerosil(non-modified silica)/epoxy-nanocomposites decreased from 125 to 118 ℃ with increasing Aerosil contents and moduli increased from 2,225 to 2,523 MPa with increasing Aerosil contents. Tg of AMS/M-silica (modified silica)/epoxy-nanocomposites decreased from 124 to 120 ℃ with increasing M-silica contents and moduli increased from 1,981 to 2,743 MPa with increasing M-silica contents. CTE of AMS/Aerosil/epoxy-nanocomposites and AMS/M-silica/ epoxy-nanocomposites showed decreasing tendency regardless of the surface treatments.