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Issue
Total 2 articles [ 키워드: Through Silicon Via ]
No. Article
1 Korean Chemical Engineering Research, 54 (6), pp.723-733 (2016)
구리 전해 도금을 이용한 실리콘 관통 비아 채움 공정
Through-Silicon-Via Filling Process Using Cu Electrodeposition
김회철, 김재정
2 Korean Chemical Engineering Research, 47 (1), pp.1-10 (2009)
3차원 집적회로 반도체 칩 기술에 대한 경향과 전망
Trend and Prospect for 3Dimensional Integrated-Circuit Semiconductor Chip
권용재