The electrodeposition of FePt alloy film in a novel ferric electrolyte that could be an alternative electrolyte to the usual non-stable baths was investigated. The influence of the applied current density and electrolyte temperature on the composition of the alloy was studied. It was found that co-deposition of oxygen can be reduced by deposition at higher temperature of 65 ℃ than room temperature. The as-deposited film had a face-centered cubic (γ-Fe,Pt) structure, and after an additional annealing process, the structure was changed to a face-centered tetragonal structure. The as-deposited FePt film also shows good resistance to corrosion and its coercivity was about 0.1T, which makes it suitable for use in applications compatible with silicon technology.