About The Journal
  Aims and Scope
  Editorial Board
  Submit a Manuscript 
  Subscription Information
  Guidelines for Publication
  Ethics
Articles & Issues
  Search
  Issue
  Online First
  KJChE on
For Authors
  Instructions to Authors
  Ethical Responsibilities of
  Authors in KJChE
  Ethics in Publishing
  Peer Review Process
  Author's Checklist
  Copyright Transfer Form
Contact us
 
 
 
Issue
Korean Journal of Chemical Engineering,
Vol.38, No.8, 1720-1726, 2021
Transparent Metal-Mesh heater using Silver-coated copper nanoparticles sintered with intense pulsed light irradiation on PET substrate
Song SM, Cho SM
A transparent metal-mesh heater was fabricated by intense pulsed light (IPL) sintering of copper-based particle ink on a polyethylene terephthalate (PET) substrate having a low glass transition temperature. The metal-mesh electrode with a line width of 9 μm was formed by filling imprinted intaglio patterns with silver-coated copper particle ink. This silver-coated copper particle is based on inexpensive copper and has excellent oxidation resistance as pure silver particle at temperatures up to 150 °C, making it suitable as a metal particle for metal-mesh heaters. This metal ink was IPL-sintered for the short time of 20ms to obtain a transparent electrode with a low sheet resistance of 2Ω/sq. without deterioration of the PET substrate. The silver thin film coated on the surface of the copper particles not only effectively blocks the reduction heat that may occur during the IPL sintering process, but also plays an important role in preventing the oxidation of copper during the operation of the transparent heater. It was confirmed that this flexible heater with 85% transparency is capable of stable operation up to 130 °C at a low voltage of 9 V.
Keywords: Intense Pulsed Light; Sintering; Transparent Electrode; Transparent Heater
[References]
  1. Watanabe K, Iwaki Y, Uchida Y, Nakamura D, Ikeda H, Katayama M, Cho T, Miyake H, Hirakata Y, Yamazaki S, J. Soc. Inf. Display, 24, 12, 2016
  2. Park KT, Kim HJ, Park MJ, Jeong JH, Lee J, Choi DG, Lee JH, Choi JH, Sci. Rep., 5, 12093, 2015
  3. Kumar A, Zhou C, ACS Nano, 4, 11, 2010
  4. Hecht DS, Hu L, Irvin G, Adv. Mater., 223, 1482, 2011
  5. Pang SP, Hernandez Y, Feng XL, Mullen K, Adv. Mater., 23(25), 2779, 2011
  6. Jang J, Mater. Today, 9, 46, 2006
  7. Lee JY, Connor ST, Cui Y, Peumans P, Nano Lett., 8, 689, 2008
  8. Kim JW, Lee SW, Lee Y, Jung SB, Hong SJ, Kwak MG, J. Nanosci. Nanotechnol., 13, 6244, 2013
  9. Lipomi DJ, Lee JA, Vosgueritchian M, Tee BCK, Bolander JA, Bao Z, Chem. Mater., 24, 373, 2012
  10. Cho N, Jung Y, Chung KB, Kang S, Curr. Nanosci., 9, 521, 2013
  11. Shin K, Park RK, Yu L, Park CY, Lee YS, Lim YS, Han JH, Synth. Met., 161, 1596, 2011
  12. Han S, Chae Y, Kim JY, Jo Y, Lee SS, Kim SH, Woo KH, Jeong SH, Choi YM, Lee SY, J. Mater. Chem. C, 6, 4389, 2018
  13. Jang HY, Lee SK, Cho SH, Ahn JH, Park S, Chem. Mater., 25, 3535, 2013
  14. Kim BJ, Park JS, Hwang YJ, Park JS, Thin Solid Films, 596, 68, 2015
  15. Nam H, Seo D, Yun H, Thangavel G, Park L, Nam S, Metals, 7, 176, 2017
  16. Horiuchi Y, Suzuki Y, Noh JH, Honma H, Takai O, Cordonier CEJ, Electrochemistry, 84, 971, 2016
  17. Zhang X, Pan Y, Zhao J, Hao X, Wang Y, Schubert DW, Liu L, Shen C, Liu X, Engineered Science, 7, 65, 2019
  18. Zhou W, Chen J, Li Y, Wang D, Chen J, Feng X, Huang Z, Liu R, Lin X, Zhang H, Mi B, Ma Y, ACS Appl. Mater. Interfaces, 8, 11122, 2016
  19. Hutter OS, Stec HM, Hatton RA, Adv. Mater., 25(2), 284, 2012
  20. Kim DJ, Kim HJ, Seo KW, Kim KH, Kim TW, Kim HK, Sci. Rep., 5, 1, 2015
  21. Dharmadasa R, Jha M, Amos DA, Druffel T, ACS Appl. Mater. Interfaces, 5, 13227, 2013
  22. Xu P, Hamilton MC, IEEE Microw. Wirel. Compon. Lett., 23(4), 178, 2013
  23. Han Y, Zhong H, Liu N, Liu Y, Lin J, Jin P, Adv. Electron. Mater., 4, 180015, 2018
  24. Jang S, Seo Choi J, Kim T, Cho J, Kim S, Kim D, Scr. Mater., 62, 258, 2010
  25. Wang BY, Yoo TH, Song YW, Lim DS, Oh YJ, ACS Appl. Mater. Interfaces, 5, 4113, 2013
  26. Rager MS, Aytug T, Veith GM, Joshi P, ACS Appl. Mater. Interfaces, 8, 2441, 2016
  27. Hwang HJ, Chung WH, Kim HS, Nanotechnology, 23, 485205, 2012
  28. Joo M, Lee B, Jeong S, Lee M, Thin Solid Films, 520(7), 2878, 2012
  29. Ryu J, Kim HS, Hahn HT, J. Electron. Mater., 40, 42, 2010
  30. Chung WH, Hwang YT, Lee SH, Kim HS, Nanotechnology, 27, 205704, 2016
  31. Hwang HJ, Oh KH, Kim HS, Sci. Rep., 6, 1, 2016
  32. Park J, Han D, Choi S, Kim Y, Kwak J, RSC Adv., 9, 5731, 2019
  33. Veeramuthu L, Chen BY, Tsai CY, Liang FC, Venkatesan M, Jiang DH, Chen CW, Cai X, Kuo CC, RSC Adv., 9, 35786, 2019
  34. Perelaer J, de Gans BJ, Schubert US, Adv. Mater., 18(16), 2101, 2006
  35. Chen X, Wu X, Shao S, Zhuang J, Xie L, Nie S, Su W, Chen Z, Cui Z, Sci. Rep., 7, 1, 2017
  36. Li W, Hu D, Li L, Li CF, Jiu J, Chen C, Ishina T, Sugahara T, Suganuma K, ACS Appl. Mater. Interfaces, 9, 24711, 2017
  37. Wu X, Shao S, Chen Z, Cui Z, Nanotechnology, 28, 035203, 2016
  38. Macneill W, Choi CH, Chang CH, Malhotra R, Sci. Rep., 5, 1, 2015
참고문헌정보(참고문헌, 인용문헌)는 화학공학소재연구정보센터에 의해 제공되고 있습니다.