Issue
Total 249 articles [ 키워드: Thermal ]
No. Article
31 Korean Journal of Chemical Engineering, 38 (11), pp.2195-2207 (2021)
Thermo-economic evaluation of R1233zd(E) as an R245fa alternative in organic Rankine cycle for geothermal applications
Li G
32 Korean Journal of Chemical Engineering, 38 (10), pp.2091-2105 (2021)
Utilization of geothermal waste as a silica adsorbent for biodiesel purification
Silviana S, Anggoro DD, Salsabila CA, et al.
33 Korean Journal of Chemical Engineering, 38 (9), pp.1946-1955 (2021)
Thermal properties and curing kinetics of epoxy powder coatings containing graphene nanoplatelets
Vanzetto AB, Agnol LD, Lavoratti A, et al.
34 Korean Journal of Chemical Engineering, 38 (7), pp.1333-1347 (2021)
Multiscale modeling and integration of a combined cycle power plant and a two-tank thermal energy storage system with gPROMS and SimCentral
Chang JH, Lee GH, Adams D, et al.
35 Korean Journal of Chemical Engineering, 38 (4), pp.788-796 (2021)
Integration of hemicellulose pre-extraction and solid alkali-oxygen cooking processes for lignocellulose fractionation with emphasis on xylan valorization
Jiang Y, Wang X, Wu Z, et al.
36 Korean Journal of Chemical Engineering, 38 (4), pp.797-806 (2021)
Hydrothermal carbonization of oil palm trunk via taguchi method
Qureshi SS, Premchand, Javed M, et al.
37 Korean Journal of Chemical Engineering, 38 (4), pp.872-884 (2021)
A novel synthesis of ditrimethylolpropane biphosphoramide diethyleneamine as flame retardant and antistatic textiles
Jiang W, Li JF, Li ZY, et al.
38 Korean Journal of Chemical Engineering, 38 (1), pp.163-169 (2021)
Synthesis and photocatalytic performance of Bi2WO6/BiOX (X=Cl, Br, I) composites for RhB degradation under visible light
Derikvand L, Tahmasebi N
39 Korean Journal of Chemical Engineering, 38 (1), pp.187-194 (2021)
Morphological improvement of CH3NH3PbI3 films using blended solvents for perovskite solar cells
Le N, Truong NTN, Le T, et al.
40 Korean Journal of Chemical Engineering, 37 (12), pp.2104-2116 (2020)
Effects of heat sink structure on heat transfer performance cooled by semiconductor and nanofluids
Qi C, Chen T, Tu J, et al.
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