| Issue |
| Total 1 articles [ 키워드: Cu Seed Layer Damage ] |
| No. | Article |
| 1 |
Korean Journal of Chemical Engineering, 34 (5), pp.1490-1494 (2017) Cu seed layer damage caused by insoluble anode in Cu electrodeposition Ham YS, Cho SK, Kim JJ |
| Print: | ISSN 0256-1115 |
| Online: | ISSN 1975-7220 |
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