| Issue |
| Total 2 articles [ 키워드: Cu Electrodeposition ] |
| No. | Article |
| 1 |
Korean Journal of Chemical Engineering, 36 (6), pp.981-987 (2019) High strength Cu foil without self-annealing prepared by 2M5S-PEG-SPS Lee A, Kim MJ, Choe SH, et al. |
| 2 |
Korean Journal of Chemical Engineering, 34 (5), pp.1490-1494 (2017) Cu seed layer damage caused by insoluble anode in Cu electrodeposition Ham YS, Cho SK, Kim JJ |
