Tetrafluoromethane(CF4) has been used as etching and chamber cleaning gases for semiconductor manufacturing processes. These gases need to be removed efficiently because of their strong absorption of infrared radiation and long atmospheric lifetime which causes the global warming effect. We have developed a waterjet gliding arc plasma system in which plasma is combined with waterjet and investigated optimum operating conditions for efficient CF4 destruction through enlarging discharge region and producing large amount of OH radicals. The operating conditions are waterjet flow rate, initial CF4 concentration, total gas flow rate, specific energy input. Through the parametric studies, the highest CF4 destruction of 97% was achieved at 2.2% CF4, 7.2 kJ/L SEI, 9 L/min total gas flow rate and 25.5 mL/ min waterjet flow rate.