Search / Korean Journal of Chemical Engineering
Korean Chemical Engineering Research,
Vol.45, No.4, 384-390, 2007
PET 필름기재의 구리 무전해도금에 있어서 초임계 CO2 유체가 도금 특성에 미치는 영향
Effect of Added Supercritical CO2 on the Characteristics of Copper Electroless Plating on PET Film Substrate
본 연구는 CO2 초임계 유체를 도금액과 혼합하여 PET 필름 위에 무전해 구리도금을 실시하였으며 초임계 유체의 혼용조건에 따른 그 도금 효과를 비교하였다. 이산화탄소 초임계 유체와 도금액의 부피비는 1:9가 최적이였으며 초임계 유체가 10 vol% 이상이 되면 혼합액의 분산성이 불량해져 층분리가 발생하였다. 구리 무전해도금은 25 ℃, 15 MPa 에서 수행된 구리막의 표면물성이 가장 균일하였다. 무전해 구리도금에서 도금액과 혼합시킨 초임계 유체의 역할은 단순히 용해도를 높여 주는 것이 아니라 도금막을 구성하는 구리입자를 1차 입자상태로 분산, 유지시킴을 확인하였다.
In this study, electroless plating of copper was performed on PET film by using the blend of supercritical CO2 and plating solution. The optimum volumetric ratio of supercritical fluid and plating solution was found to be 1:9 and dispersion property was poor at CO2 vol% langer than 10%. Electroless plating of copper was best at 25 ℃ and 15 MPa. Role of added supercritical CO2 is not to increase solubility but to disperse and maintain Cu-particles as the 1st particles.
[References]
  1. Domenech SC, Lima E, Drago V, Lima JC , Borges NG, Avila AOV, Soldi V, Appl. Surf. Sci., 220, 238, 2003
  2. Hong KM, Chung JG, J. Korean Ind. Eng. Chem., 15(3), 316, 2004
  3. Hong KM, Kim MS, Lee YC, Kim NK, J. MNM, 23, 247, 2005
  4. Lee JH, Bul. Kor. Inst. Met. & Mater., 12(6), 658, 1999
  5. Lucien FP, Foster NR, J. Supercrit. Fluids, 17, 111, 2000
  6. Ruckenstein E, Shulgin I, Fluid Phase Equilib., 180(1-2), 345, 2001
  7. Guerra RM, Marin ML, Sanchez A, Jimenez A, J. Supercrit. Fluids, 22, 111, 2002
  8. Ruckenstein E, Shulgin I, Fluid Phase Equilib., 200(1), 53, 2002
  9. Duarte CMM, Crew M, Casimiro T, Aguiar-Ricardo A, J. Supercrit. Fluids, 22, 87, 2002
  10. Akaishi M, Shaji Kumar MD, Kanda H, Yamaoka S, Diam. Relat. Mat., 9, 1945, 2000
  11. Caglar A, Demirbag A, Energy Conv. Manag., 42, 1095, 2001
  12. Calvo L, Holmes JD, Yates MZ, Johnston KP, J. Supercrit. Fluids, 16(3), 247, 2000
  13. Park JY, Lim JS, Korean Chem. Eng. Res., 42(5), 494, 2004
  14. Yoshida H, Sone M, Mizushima A, Yan H, Wakabayashi H, Abe K, Tao XT, Ichihara S, Miyata S, Surf. Coat. Technol., 173, 285, 2003
  15. Kim MS, Hong KM, Lee YC, Kim NK, Kim CK, Korean J. EHS Assessment, 1(2), 35, 2003
  16. Park JY, Kim JD, Lee YW, Lee CH, Lim JS, Korean Chem. Eng. Res., 42(4), 396, 2004
  17. Kim MS, Kim CK, J. Ind. Eng. Chem., 11(6), 876, 2005
  18. Kim MS, Kim JY, Kim CK, Chemosphere, 58, 459, 2005
  19. Oh KW, Kim DJ, Kim SH, Polymer, 25(2), 302, 2001
  20. Yan H, Sone M, Sato N, Ichihara S, Miyata S, Surf. Coat. Technol., 182, 329, 2004
  21. Park JY, Kim JD, Lee YW, Lee CH, Lim JS, Korean Chem. Eng. Res., 42(4), 396, 2004
  22. Schuh CA, Nieh TG, Yamasaki T, Scripta Materialia., 46, 735, 2002
  23. Kim MS, Lee SJ, J. Supercrit. Fluids, 31, 217, 2004
  24. Lou X, Janssen HG, Cramers CA, J. Chromatogr. A, A785, 57, 1997
  25. Kim JR, Kim HK, Kyong JB, J. Korean Chem. Soc., 32, 311, 1988
  26. Huang Z, Guo YH, Sun GB, Chiew YC, Kawi S, Fluid Phase Equilib., 236(1-2), 136, 2005
  27. Jiang CY, Pan QM, Pan ZR, J. Supercrit. Fluids, 12(1), 1, 1998
  28. Lou X, Janssen HG, Cramers CA, J. Chromatogr. A, 785, 57, 1997