| Search / Korean Journal of Chemical Engineering |
HWAHAK KONGHAK,
Vol.40, No.5, 613-617, 2002
Vol.40, No.5, 613-617, 2002
코로나 방전처리에 의한 폴리이미드 필름의 표면 및 접착특성에 관한 연구
Surface and Adhesion Characteristics of Polyimide Film Treated by Corona Discharge
본 연구에서는 폴리이미드 표면에 코로나 방전 처리를 하여 필름의 표면특성을 FT-IR(Fourier Transform-IR), XPS(X-ray Photoelectron Spectroscopy) 그리고 접촉각을 통해 관찰하였고, 폴리이미드의 접착특성은 박리 접착강도(peel strength)를 측정하여 관찰하였다. 본 실험결과 코로나 처리한 폴리이미드 표면에 카르복시기 및 산소를 함유한 극성관능기가 발달하여 표면에너지의 극성요소가 증가하였으며, 결과적으로 폴리이미드/동박의 접착특성이 향상되었다. 그러나 코로나 방전 처리 후 노화시간에 따라 표면에너지가 감소하는 것을 확인할 수 있었다. 이러한 결과는 코로나 처리에 의한 폴리이미드 필름의 표면관능기의 생성 또는 노화시간에 따른 활성점의 감소에 의해 확인할 수 있었다.
In this work, the effect of corona discharge treatment on surface properties of polyimide film was investigated in terms of FT-IR(Fourier Transform-IR), XPS(X-ray Photoelectron Spectroscopy) and contact angles. And the adhesion characteristics of the film were studied in peel strengths of polyimide coatings. As a result, polyimide surfaces treated by corona discharge led to an increase of oxygen-containing functional groups or polar component of the surface free energy, resulting in improving the adhesion characteristics of the polyimide/copper foil. However, the surface energy of the film was decreased as the aging time increased. These results could be discussed in the formation of surface functional groups or deterioration of reactive sites of polyimde film in the presence of corona treatment with aging time.
[References]
- Laius LA, Polyimide: Thermally Stable Polymer, Consultants Bureau, New York, 1987
- Qu WL, Ko TM, J. Appl. Polym. Sci., 82(7), 1642, 2001
- Yu J, Ree M, Shin TJ, Wang X, Cai W, Zhou D, Lee KW, J. Polym. Sci. B: Polym. Phys., 37(19), 2806, 1999
- Lu QH, Li M, Yin J, Zhu ZK, Wang ZG, J. Appl. Polym. Sci., 82(11), 2739, 2001
- Patel HS, Patel VC, Eur. Polym. J., 37, 2263, 2001
- Ranucci E, Sandgren A, Andronova N, Albertsson AC, J. Appl. Polym. Sci., 82(8), 1971, 2001
- Park SJ, Kim JS, J. Colloid Interface Sci., 244(2), 336, 2001
- Seto F, Fukuyama K, Muraoka Y, Kishida A, Akashi M, J. Appl. Polym. Sci., 68(11), 1773, 1998
- Suzer S, Argun A, Vatansever O, Aral O, J. Appl. Polym. Sci., 74(7), 1846, 1999
- Novak I, Folrian S, Polym. Int., 50, 49, 2001
- Park SJ, Kim JS, J. Colloid Interface Sci., 232(2), 311, 2000
- Park SJ, Jin JS, J. Colloid Interface Sci., 236(1), 155, 2001
- Adamson AW, Physical Chemistry of Surfaces, 5ed., John Wiley, New York, Chap. 10, 1990
- Lee JH, Lee HB, J. Biomed. Mater. Res., 41, 304, 1998
- Kinloch AJ, Adhesion and Adhesives, Chapman and Hall, New York, 1987
- Lewis AF, Epoxy Resin: Chemistry and Technology, Marcel Dekker, New York, 1988
- Postor-Blas MM, Martin-Martinez JM, Dillard JG, Surf. Interface Anal., 26, 385, 1998
- Sanchez-Adsuar MS, Papon E, Villenave JJ, J. Appl. Polym. Sci., 82(14), 3402, 2001
참고문헌정보(참고문헌, 인용문헌)는 화학공학소재연구정보센터에 의해 제공되고 있습니다.