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Search / Korean Journal of Chemical Engineering
Total 1 articles [ 키워드: Three-dimensional Integration Circuits ]
No. Article
1 Korean Chemical Engineering Research, 45 (5), pp.466-472 (2007)
저유전체 고분자 접착 물질을 이용한 웨이퍼 본딩을 포함하는 웨이퍼 레벨 3차원 집적회로 구현에 관한 연구
A Study on Wafer-Level 3D Integration Including Wafer Bonding using Low-k Polymeric Adhesive
권용재, 석종원, Lu JQ, et al.