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Search / Korean Journal of Chemical Engineering
Total 2 articles [ 키워드: Superfilling ]
No. Article
1 Korean Chemical Engineering Research, 54 (6), pp.723-733 (2016)
구리 전해 도금을 이용한 실리콘 관통 비아 채움 공정
Through-Silicon-Via Filling Process Using Cu Electrodeposition
김회철, 김재정
2 Korean Chemical Engineering Research, 52 (1), pp.26-39 (2014)
반도체 소자용 구리 배선 형성을 위한 전해 도금
Electrodeposition for the Fabrication of Copper Interconnection in Semiconductor Devices
김명준, 김재정