Korean Chem. Eng. Res.
Print:
ISSN 0304-128X
Online:
ISSN 2233-9558
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Search / Korean Journal of Chemical Engineering
Total
1
articles [
키워드
:
Mooney
]
No.
Article
1
HWAHAK KONGHAK
,
38
(4), pp.463-466 (2000)
반도체 칩 패키지용 액상 봉지재의 점도거동 연구
Study on the Viscosity Behaviors of Liquid Encapsulant for Semi-Conductor Chip Packaging
김인범, 이명천
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