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Search / Korean Journal of Chemical Engineering
Total 1 articles [ 키워드: Encaqsulant ]
No. Article
1 HWAHAK KONGHAK, 38 (4), pp.463-466 (2000)
반도체 칩 패키지용 액상 봉지재의 점도거동 연구
Study on the Viscosity Behaviors of Liquid Encapsulant for Semi-Conductor Chip Packaging
김인범, 이명천