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Search / Korean Journal of Chemical Engineering
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| Total 4 articles [ 키워드: Electroplating ] |
| No. |
Article |
| 1 |
Korean Chemical Engineering Research, 54 (1), pp.108-113 (2016)
A Study on the Deposit Uniformity and Profile of Cu Electroplated in Miniaturized, Laboratory-Scale Through Mask Plating Cell for Printed Circuit Board (PCBs) Fabrication
Cho SK, Kim JJ |
| 2 |
Korean Chemical Engineering Research, 44 (2), pp.160-165 (2006)
Cu Reflow를 이용한 Pd-Cu-Ni 합금 수소분리막 특성
Characteristic of Pd-Cu-Ni Alloy Hydrogen Membrane using the Cu Reflow
김동원, 김흥구, 엄기연, et al. |
| 3 |
Korean Chemical Engineering Research, 43 (1), pp.53-59 (2005)
고압 매크로에멀젼을 이용한 전해도금에 관한 연구
A Study on the Electroplating using Macroemulsion in High Pressure
박지영, 양준열, 서동진, et al. |
| 4 |
HWAHAK KONGHAK, 41 (5), pp.649-654 (2003)
은 함유 활성탄소섬유의 기공특성 및 이에 의한 NO 제거에 관한 연구
Studies on Textural Properties of Activated Carbon Fibers Containing Silver Metal and their NO Removal Test
박수진, 김병주, Kawasaki J |
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