Korean Chem. Eng. Res.
Print:
ISSN 0304-128X
Online:
ISSN 2233-9558
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Search / Korean Journal of Chemical Engineering
Total
1
articles [
키워드
:
Copper Seed Layer
]
No.
Article
1
HWAHAK KONGHAK
,
39
(6), pp.721-726 (2001)
갈바니 치환 증착 방법을 이용한 확산방지막 위에서의 구리 시드층 형성
Fabrication of Cu Seed Layer on TiN Barrier using Galvanic Displacement Deposition
김재정, 강무성
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