Korean Chem. Eng. Res.
Print:
ISSN 0304-128X
Online:
ISSN 2233-9558
About The Journal
Aims and Scope
Editorial Board
Submit a Manuscript
Subscription Information
Articles & Issues
Issue
Search
For Authors
Instructions to Authors
Ethics in Publishing
Peer Review Process
Author's Checklist
Copyright Transfer Form
Contact us
Issue
Total
1
articles [
키워드
:
Through silicon via (TSV)
]
No.
Article
1
Korean Chemical Engineering Research
,
54
(6), pp.723-733 (2016)
구리 전해 도금을 이용한 실리콘 관통 비아 채움 공정
Through-Silicon-Via Filling Process Using Cu Electrodeposition
김회철, 김재정
Search